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US 2026/0101437 A1Published application
Base material for mounting electronic device
AssigneeToyo Seikan Group Holdings, Ltd.
InventorsShinpei OKUYAMA, Yusuke OBU, Kenji HAYASHI
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Abstract
A base material for mounting an electronic device, the base material including a metal foil and a protective resin layer, in which the protective resin layer is provided on a surface of the metal foil on one side, a surface of the metal foil on the other side is a surface on a side on which the electronic device is mounted, and a hygroscopic resin layer is provided on the surface of the metal foil on the other side.
Claims15
A base material for mounting an electronic device, the base material comprising:
- a metal foil;
- and
- a protective resin layer,
- wherein
- the protective resin layer is provided on a surface of the metal foil on one side,
- a surface of the metal foil on the other side is a surface on a side on which the electronic device is mounted, and
- a hygroscopic resin layer is provided on the surface of the metal foil on the other side.
4 more elements
Dependencies are inferred from the claim text.