Printed circuit board arrangement

A printed circuit board assembly comprising:

• a printed circuit board having a top side and an underside;
• electrical modules having a top side and an underside, wherein the top side of the electrical modules are arranged on the underside of the printed circuit board;
• a heat sink that is thermally coupled with the underside of the electrical modules;
• and
• a hold-down device,
• wherein the heat sink has a structured top side comprising cavities and bearing structures arranged between the cavities and forming a bearing surface for the printed circuit board,
• wherein the underside of the printed circuit board lies on the bearing surface,
• wherein the region of the underside that is lying on the bearing surface forms a bottom abutment surface,
• wherein the electrical modules project into the cavities of the heat sink, and
• wherein the hold-down device has projecting structures that lie against the top side of the printed circuit board at contact points located opposite the bottom abutment surface and apply a hold-down force to the contact points.