Semiconductor devices and methods of manufacturing thereof

An integrated circuit, comprising:

• a plurality of semiconductor dies disposed on a single semiconductor substrate, wherein each of the plurality of semiconductor dies comprises a plurality of operative modules, and a plurality of power switches coupled to the plurality of operative modules, respectively;
• a power network disposed with respect to the plurality of semiconductor dies, and configured to provide a supply voltage to each of the plurality of semiconductor dies;
• and
• a power control circuit disposed on the semiconductor substrate;
• wherein the power control circuit is configured to:
• receive a first signal indicating one or more operative modules of at least one of the plurality of semiconductor dies have failed;
• and
• based on the first signal, send a second signal to the corresponding power switches coupled to the one or more operative modules, respectively, so as to disconnect the supply voltage from being provided to the one or more operative modules.