Sheath and Temperature Control of Process Kit

A substrate support, comprising:

• a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
• a first cooling plate coupled to the second side of the ceramic plate;
• a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
• a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate, wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant;
• one or more sealing elements disposed adjacent to:
• the ceramic ring and the second cooling plate;
• and
• the ceramic ring and the ceramic plate;
• and
• an edge ring disposed on the ceramic ring and a thermal pad disposed between the edge ring and the ceramic ring.

A process chamber, comprising:

• a chamber body having a substrate support disposed within an inner volume of the chamber body, wherein the substrate support includes a ceramic plate having a first side configured to support a substrate and a second side opposite the first side, wherein the ceramic plate includes an electrode embedded in the ceramic plate;
• a first cooling plate coupled to the second side of the ceramic plate;
• a ceramic ring disposed about the ceramic plate and having a first side and a second side opposite the first side, wherein the ceramic ring includes one or more chucking electrodes and a heating element disposed in the ceramic ring, wherein the ceramic ring is spaced apart from the ceramic plate and the first cooling plate;
• a second cooling plate coupled to the second side of the ceramic ring, wherein the second cooling plate is thermally isolated from the first cooling plate, wherein the first cooling plate and the second cooling plate include coolant channels configured to circulate a coolant;
• and
• a sealing element disposed adjacent to the ceramic ring and the ceramic plate.