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US 2026/0100335 A1Published application
Plasma processing device including baffle for plasma confining
AssigneeVM Inc.
InventorsSang Woo Lee, Woo Hyung Choi
Life of this patent
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Abstract
A plasma processing device is proposed. The plasma processing device includes an electrostatic chuck configured to support a substrate inside a chamber, and a baffle including a body section having a cylindrical shape and a wing section having a ring shape along an edge of the body section, wherein the wing section includes a first set of slits configured to discharge at least a part of gas provided for the substrate.
Claims10
A plasma processing device comprise:
- an electrostatic chuck configured to support a substrate inside a chamber;
- and
- a baffle comprising a body section having a cylindrical shape and a wing section having a ring shape along an edge of the body section,
- wherein the wing section comprise a first set of slits configured to discharge at least a part of gas provided for the substrate.
1 more element
Dependencies are inferred from the claim text.