Apparatus for data read timing calibration in stacked memory
AssigneeMicron Technology, Inc.
InventorsJaeil Kim, Nicole Kang, Vijayakrishna Vankayala, Jason M. Brown
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AssigneeMicron Technology, Inc.
InventorsJaeil Kim, Nicole Kang, Vijayakrishna Vankayala, Jason M. Brown
Estimating the term…
Embodiments of the disclosure provide an apparatus comprising a plurality of through-silicon vias (TSVs), a plurality of core dies, and a calibration circuit. The core dies are stacked with one another, and each core die outputs read data to one or more assigned TSVs of the plurality of TSVs in response to a read enable signal. The calibration circuit compares data read timings of the core dies to determine a slowest core die, and adds a delay to the read enable signal of at least one of the core dies other than the slowest core die to cause the data read timing of the at least one of the core dies match the data read timing of the slowest core die.
An apparatus, comprising:
An apparatus, comprising:
An apparatus, comprising:
Dependencies are inferred from the claim text.