Photosensitive resin composition, method for producing cured relief pattern using same, and method for producing polyimide film using same

A photosensitive resin composition comprising:

• (A) a polyimide precursor and/or a polyimide resin,
• (B) a tetrazole derivative,
• (C) a photopolymerization initiator, and
• (D) a solvent,
• wherein the tetrazole derivative (B) contains a compound represented by following general formula (1):
• wherein, in formula (1), R1 is a hydrogen atom, or a monovalent organic group selected from the group consisting of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 10 carbon atoms, and hydrogen atoms of the alkyl group and the aryl group may or may not be each independently substituted with at least one substituent selected from the group consisting of a halogen atom, a hydroxyl group, an alkoxysilyl group and an amino group,
• or following general formula (2):
• wherein, in formula (2), R2 is a hydrogen atom, or a monovalent organic group selected from the group consisting of an alkyl group having 1 to 10 carbon atoms and an aryl group having 6 to 10 carbon atoms, R3 is an alkylene group having 1 to 10 carbon atoms, and hydrogen atoms of the alkyl group, the aryl group and the alkylene group may or may not be each independently substituted with at least one substituent selected from the group consisting of a halogen atom, a hydroxyl group, an alkoxysilyl group and an amino group.

A photosensitive resin composition comprising:

• (A) a polyimide precursor and/or a polyimide resin,
• (B) a tetrazole derivative,
• (C) a photopolymerization initiator, and
• (D) a solvent,
• wherein the tetrazole derivative (B) has a polar surface area (tPSA) of 81 to 200.