Semiconductor package structure

Abstract

A semiconductor package structure includes a photonic integrated circuit chip and a fiber array unit. The photonic integrated circuit chip includes an optical waveguide, a grating coupler, and a dielectric structure. The grating coupler is connected to the optical waveguide. The dielectric structure is located on the optical waveguide and the grating coupler and has a first positioning member located on an upper surface of the dielectric structure. The fiber array unit is located on the photonic integrated circuit chip and includes a fiber holder and an optical fiber. The fiber holder has a second positioning member located on a lower surface of the fiber holder, in which the first positioning member and the second positioning member fit together. The optical fiber is fixed to the fiber holder and optically coupled to the grating coupler.

Dependencies are inferred from the claim text.