US 2026/0099015 A1 · PHOTONIC INTEGRATED CIRCUIT PACKAGING ARCHITECTURES

Abstract

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating material with the active side facing up; an optical component optically coupled to the active surface of the PIC and extending at least partially through the first layer; and an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material, wherein the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the active side of the PIC.

Claims35

Dependent claims

An integrated circuit (IC) device assembly, comprising:

a circuit board;
a package substrate over the circuit board, the package substrate having a first surface and a second surface opposite the first surface;
coupling components between the circuit board and the first surface of the package substrate;
a photonic integrated circuit (PIC) die over a first portion of the second surface of the package substrate, wherein the PIC die includes a waveguide, an optical modulator, a photodetector, and a phase shifter;
an electronic integrated circuit (EIC) die over the PIC die, wherein the EIC die includes a driver circuit or a transimpedance amplifier, and wherein the PIC die is between the package substrate and the EIC die;
flip-chip interconnects between the PIC die and the EIC die;
a processor die over a second portion of the second surface of the package substrate;
an optical coupler coupled to the waveguide;
an optical glue between the optical coupler and the waveguide;
and
a heat transfer structure over the processor and the EIC die.

8 more elements

Dependencies are inferred from the claim text.

Photonic integrated circuit packaging architectures

Life of this patent

Photonic integrated circuit packaging architectures

Life of this patent

Abstract

Claims35