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US 2026/0099014 A1Published application
Semiconductor package with embedded optical die
AssigneeIntel Corporation
InventorsVivek RAGHUNATHAN, Myung Jin YIM
Life of this patent
Estimating the term…
Abstract
Semiconductor package with one or more optical die(s) embedded therein is disclosed. The optical die(s) may have one or more overlying interconnect layers. Electrical contact to the optical die may be via the one or more overlying interconnect layers. An optical waveguide may be disposed next to the optical die and embedded within the semiconductor package. An optical fiber may be optically coupled to the optical waveguide.
Claims30
An electronic assembly, comprising:
- a board;
- a package substrate;
- package-to-board interconnects between the board and the package substrate;
- a first electronic component over a first portion of the package substrate, the first electronic component comprising an integrated circuit;
- a first interconnect between the package substrate and the first electronic component;
- a second electronic component over a second portion of the package substrate, the second electronic component comprising memory;
- a second interconnect between the package substrate and the second electronic component;
- an optical die over a third portion of the package substrate, wherein an optical output of the optical die is at a lateral surface of the optical die, and wherein a distance between the first electronic component and the optical die is smaller than a distance between the first electronic component and the second electronic component;
- conductive contacts at a top surface of the optical die;
- a volume between an edge of the package substrate and the lateral surface of the optical die;
- an optical fiber extending, from the edge of the package substrate, through at least a portion of the volume and optically coupled to the lateral surface of the optical die;
- and
- a solid material adjacent to a portion of the optical fiber closest to the lateral surface of the optical die.
10 more elements
An electronic assembly, comprising:
- a board;
- a package substrate;
- ball grid array (BGA) connections between the board and the package substrate;
- a first electronic component over a first portion of the package substrate;
- a first interconnect between the package substrate and the first electronic component;
- a second electronic component over a second portion of the package substrate;
- a second interconnect between the package substrate and the second electronic component;
- an optical die over a third portion of the package substrate, wherein an output of the optical die is at a side surface of the optical die, and wherein a distance between the first electronic component and the optical die is smaller than a distance between the first electronic component and the second electronic component;
- conductive contacts at a top surface of the optical die;
- and
- a volume between an edge of the package substrate and the side surface of the optical die.
8 more elements
An electronic assembly, comprising:
- a package substrate;
- a first electronic component over the package substrate, the first electronic component comprising an integrated circuit;
- a second electronic component over the package substrate, the second electronic component comprising memory;
- a photonic die over the package substrate, wherein:
- the photonic die includes conductive contacts at a first surface of the photonic die,
- an optical output of the photonic die is at a second surface of the photonic die,
- the second surface of the photonic die and the first surface of the photonic die intersect, and
- a distance between the first electronic component and the photonic die is smaller than a distance between the first electronic component and the second electronic component;
- and
- an optical fiber coupled to the second surface of the photonic die.
7 more elements
Dependencies are inferred from the claim text.