Semiconductor assemblies and semiconductor packages

A semiconductor assembly comprising:

• a first semiconductor substrate having a front surface and a back surface opposite the front surface, the first semiconductor substrate comprising a first through-hole extending from the front surface to the back surface of the first semiconductor substrate, wherein a first optical waveguide structure is formed in the first through-hole for guiding optical waves between the front surface and the back surface of the first semiconductor substrate;
• a second semiconductor substrate having a front surface and a back surface opposite to the front surface, the second semiconductor substrate comprising a second through-hole extending from the front surface to the back surface of the second semiconductor substrate, wherein a second optical waveguide structure is formed in the second through-hole for guiding optical waves between the front surface and the back surface of the second semiconductor substrate,
• wherein the first semiconductor substrate and the second semiconductor substrate are spaced apart from each other and arranged for coupling optical waves from the first optical waveguide structure into the second optical waveguide structure;
• and
• at least one first optical lens or at least one first optical meta-structure configured to refract the optical waves coupled out from the first optical waveguide structure toward the second optical waveguide structure, or at least one second optical lens or at least one second optical meta-structure configured to refract the optical waves coupled out from the first optical waveguide structure toward the second optical waveguide structure.