Metal ion feeding system for electrolytic plating apparatus and metal ion feeding method to electrolytic plating apparatus

A metal ion feeding system for an electrolytic plating apparatus, the metal ion feeding system comprising

• an anode chamber that comprises an anode and that is packed with an anolyte,
• a cathode chamber that comprises a cathode and that is packed with a catholyte,
• a first plating solution circulation chamber defined with a first diaphragm and a second diaphragm and placed between the anode chamber and the cathode chamber, and
• one or more stacked module between the first plating solution circulation chamber and the cathode, the stacked module comprising an anolyte chamber packed with an anolyte and a second plating solution circulation chamber defined with a third diaphragm and a fourth diaphragm,
• wherein the third diaphragm is formed from the same material as that of the first diaphragm, and the fourth diaphragm is formed from the same material as that of the second diaphragm,
• the first plating solution circulation chamber and the second plating solution circulation chamber each comprise an outlet for bleeding a plating solution to an electrolytic plating apparatus, and an inlet for receiving the plating solution from the electrolytic plating apparatus so that the plating solution is circulatable, and
• the anolyte chamber comprises an outlet for bleeding the anolyte from the anolyte chamber and an inlet for receiving the anolyte in the anolyte chamber so that the anolyte in the anode chamber is capable of being in fluid communication.