Chemical-mechanical polishing composition for silver polishing

A method of chemically-mechanically polishing a substrate comprising:

• (i) providing a substrate,
• (ii) providing a polishing pad,
• (iii) providing a chemical-mechanical polishing composition comprising:
• (a) about 0.001 wt. % to about 10 wt. % an abrasive selected from a silica abrasive, an alumina abrasive, and a combination thereof,
• (b) about 0.1 wt. % to about 10 wt. % of a polishing promoter compound comprising (i) at least two nitrogen atoms and (ii) at least two chemical moieties selected from a phosphonic acid, a carboxylic acid, an alcohol, an anhydride, and a combination thereof,
• (c) 100 ppm to about 5000 ppm of a topography control agent comprising a nonionic polymer, an anionic polymer, or a combination thereof,
• (d) about 100 ppm to about 5000 ppm of a corrosion inhibitor, and
• (e) water,
• (iv) contacting the substrate with the polishing pad and the chemical-mechanical polishing composition, and
• (v) moving the polishing pad and the chemical-mechanical polishing composition relative to the substrate to abrade at least a portion of the substrate to polish the substrate.