Semiconductor device fabrication methods and devices for forming the same

A method of forming a semiconductor device, comprising:

• forming a material layer on a substrate;
• and
• planarizing the material layer by a chemical mechanical process using a polishing pad having a plurality of pad fractions with different hardness arranged with a pattern corresponding to a predetermined feature of the material layer.

A method of forming a polishing pad, comprising:

• using a three-dimensional printing process to deposit a first material, a second material, and a third material to form a plurality of first pad fractions, a plurality of second pad fractions, and a plurality of third pad factions respectively, wherein the wherein the first material has a first hardness, the second material has a second hardness different from the first hardness, and the third material includes a water-soluble material;
• and
• dissolving the water-soluble material to convert the plurality of third pad fractions into porous pad fractions.