Surface-mount-type optical module and co-packaged optics switch assembly including the same

A co-packaged optics switch assembly comprising:

• a system board;
• a surface-mount-type optical module mounted on the system board;
• and
• a switch application specific integrated circuit (ASIC) mounted on the system board and electrically connected to the surface-mount-type optical module by a redistribution layer and a through via formed in the system board,
• wherein the surface-mount-type optical module comprises:
• a glass interposer;
• a plurality of solder pads formed in a two-dimensional (2D) array of a matrix form on a lower surface of the glass interposer and bonded to the system board;
• and
• an optical engine mounted on the glass interposer and electrically connected to the plurality of solder pads by through glass vias and interposer redistribution layers formed in the glass interposer, and
• each of the plurality of solder pads is formed at a position offset by a predefined distance in a horizontal direction not to overlap the through glass vias in a vertical direction.