Ball grid array (bga) structure for drop-shock performance
AssigneeQorvo US, Inc.
InventorMD Hasnine
Life of this patent
Estimating the term…
Abstract
Ball grid array (BGA) structures for drop-shock performance are disclosed. In one aspect, balls within the BGA may have a copper core plated with a highly ductile solder. In exemplary aspects, the copper is coated with an indium solder. A nickel barrier may optionally be positioned between the copper and the indium to prevent the formation of intermetallic compounds (IMCs) between the copper and indium. The high ductility of the copper allows plastic deformation during drop-shock events, while the indium provides the desired soldering function.
Claims20
A package comprising:
- a substrate;
- a chip positioned on the substrate;
- a first plurality of uniform balls forming a ball grid array (BGA) and configured to provide electrical connections to the chip;
- a second plurality of non-uniform balls positioned proximate an outer periphery of the substrate.
An assembly comprising:
- a printed circuit board (PCB);
- and
- a package bonded to the PCB through a ball grid array (BGA), the package comprising:
- a substrate;
- a chip positioned on the substrate;
- the BGA positioned on a bottom surface of the substrate, the BGA comprising:
- a first plurality of uniform balls configured to provide electrical connections to the chip and bond the package to the PCB;
- a second plurality of non-uniform balls positioned proximate an outer periphery of the substrate.
A method of attaching a package to a printed circuit board (PCB), comprising:
- providing a first plurality of uniform balls in a ball grid array (BGA) of the package;
- providing a second plurality of non-uniform balls in the BGA at an outer edge of the package;
- and
- reflowing the uniform and non-uniform balls to attach the package to the PCB.
Dependencies are inferred from the claim text.