Microelectronic assembly with integrated passive component and semiconductor device

An apparatus, comprising:

• conductive stud bumps on a device side surface of a multilayer circuit substrate configured to mount a passive component;
• at least one semiconductor die flip-chip mounted to the device side surface of the multilayer circuit substrate, the at least one semiconductor die having bond pads coupled to conductors in the multilayer circuit substrate;
• mold compound deposited over the device side surface of the multilayer circuit substrate, the mold compound covering a portion of the semiconductor die and having a trench extending into the mold compound that exposes the conductive stud bumps;
• and
• a passive component mounted to the conductive stud bumps, the passive component having terminals that extend into the trenches in the mold compound and contact a surface of the conductive stud bumps.

A microelectronic assembly, comprising:

• a multilayer circuit substrate having conductive stud bumps on a device side surface configured to mount a passive component;
• at least one semiconductor die flip-chip mounted to the device side surface of the circuit substrate, a first one of the conductive stud bumps spaced from a first end of the semiconductor die, and a second one of the conductive stud bumps spaced from a second end of the semiconductor die;
• mold compound deposited over a portion of the at least one semiconductor die, and trenches in the mold compound exposing a surface of the conductive stud bumps, the at least one semiconductor die having a backside surface exposed from the mold compound;
• and
• a passive component having terminals mounted to the conductive stud bumps, the passive component positioned over a portion of a backside surface of the at least one semiconductor die.