Hybrid silicon cap lsc to increase bga density
AssigneeQUALCOMM Incorporated
InventorsAniket PATIL, Manuel ALDRETE, Piyush GUPTA
Life of this patent
Estimating the term…
Abstract
Disclosed are semiconductor packages. A semiconductor package may include a substrate with a ball grid array (BGA) on a lower surface thereof. The semiconductor package may also comprise a die on an upper surface of the substrate, and a land-side component (LSC) on the lower surface of the substrate. One or more edge terminals may be formed on one or more edges of the LSC. At least one edge terminal may comprise an edge insulator and an edge conductor. The edge terminals allows a substantial reduction in the keep-out-zone. As a result, more BGA balls may be provided.
Claims20
A semiconductor package, comprising:
- a substrate with a ball grid array (BGA) on a lower surface thereof, the BGA comprising one or more balls;
- a die on an upper surface of the substrate;
- a land-side component (LSC) on the lower surface of the substrate;
- and
- one or more edge terminals on one or more edges of the LSC, wherein at least one edge terminal comprises an edge insulator in contact with a side edge portion, an upper edge portion, and a lower edge portion, the side edge portion being a portion of a side surface of the LSC, the upper edge portion being a portion of an upper surface of the LSC near the side edge portion, and the lower edge portion being a portion of a lower surface of the LSC near the side edge portion.
A method of fabricating a semiconductor package, the method comprising:
- forming a substrate with a ball grid array (BGA) on a lower surface thereof, the BGA comprising one or more balls;
- providing a die on an upper surface of the substrate;
- providing a land-side component (LSC) on the lower surface of the substrate;
- and
- forming one or more edge terminals on one or more edges of the LSC, wherein at least one edge terminal comprises an edge insulator in contact with a side edge portion, an upper edge portion, and a lower edge portion, the side edge portion being a portion of a side surface of the LSC, the upper edge portion being a portion of an upper surface of the LSC near the side edge portion, and the lower edge portion being a portion of a lower surface of the LSC near the side edge portion.
Dependencies are inferred from the claim text.