Semiconductor package having first and second substrates connected to connector elements of a leadframe

A method for fabricating a semiconductor package, the method comprising:

• providing a leadframe comprising a frame, a plurality of leads connected to the frame and comprising first leads and second leads, and one or more connector elements connected to the frame;
• connecting a first substrate to the first leads via first surface bonds;
• connecting a second substrate to the connector elements via second surface bonds identical to the first surface bonds;
• attaching one or more semiconductor transistor dies to the first substrate;
• attaching a driver die to the second substrate;
• connecting the semiconductor transistor die by bond wires to the driver die;
• connecting the second substrate by bond wires to the second leads;
• applying an encapsulant to cover the first substrate, the second substrate and inner portions of the leads and connector elements of the leadframe;
• and
• removing the frame of the leadframe.