Semiconductor device and vehicle

A semiconductor device comprising:

• a first conductive portion;
• a second conductive portion;
• at least one first semiconductor element including a first electrode that is a positive electrode of a current path to be switched, a second electrode that is a negative electrode of the current path, and a third electrode that switches a conduction state between the first electrode and the second electrode;
• at least one second semiconductor element including a first electrode that is a positive electrode of a current path to be switched, a second electrode that is a negative electrode of the current path, and a third electrode that switches a conduction state between the first electrode and the second electrode;
• two first terminals;
• a second terminal;
• a third terminal;
• a first conductive member;
• a second conductive member;
• a plurality of first control terminals;
• a plurality of second control terminals;
• and
• a sealing resin, wherein
• the first conductive portion includes a first obverse surface facing a first side in a thickness direction,
• the second conductive portion includes a second obverse surface facing the first side in the thickness direction,
• in a first direction orthogonal to the thickness direction, the first conductive portion is disposed on a first side, and the second conductive portion is disposed on a second side,
• the first electrode of the first semiconductor element is conductively bonded to the first obverse surface,
• the first electrode of the second semiconductor element is conductively bonded to the second obverse surface,
• the plurality of first control terminals are located on the first side in the first direction with respect to the first semiconductor element, spaced apart from each other in a second direction orthogonal to the first direction and the thickness direction, and protrude toward the first side in the thickness direction relative to the first conductive portion,
• the two first terminals are spaced apart from each other in the second direction, each connected to the first obverse surface, and protrude toward the first side in the first direction relative to the plurality of first control terminals,
• the second terminal is located between the two first terminals in the second direction and protrudes toward the first side in the first direction relative to the plurality of first control terminals,
• the third terminal is connected to the second obverse surface,
• the first conductive member is conductively bonded to the second electrode of the first semiconductor element and the second obverse surface,
• the second conductive member is conductively bonded to the second electrode of the second semiconductor element and the second terminal, and
• the second terminal and the second conductive member form a conduction path located outside the plurality of first control terminals in the second direction.