Mitigating thermal impacts on adjacent stacked semiconductor devices

A semiconductor assembly, comprising:

• a substrate comprising a first side coupled with a first semiconductor package and a second semiconductor package, the first semiconductor package separated from the second semiconductor package in a first direction;
• and
• a temperature adjusting component coupled with a second side of the substrate and configured to draw thermal energy out of the substrate and away from the second semiconductor package, wherein the temperature adjusting component is offset from the first semiconductor package in the first direction, wherein the temperature adjusting component has a width, in a second direction perpendicular to the first direction, that is at least as wide as a width of the second semiconductor package, and wherein the temperature adjusting component extends in the second direction from at least a first horizontal edge of the second semiconductor package to at least a second horizontal edge of the second semiconductor package.

A semiconductor assembly, comprising:

• a substrate comprising a first side coupled with a first semiconductor package and a second semiconductor package, the first semiconductor package separated from the second semiconductor package in a first direction;
• and
• a temperature adjusting component coupled with a second side of the substrate and configured to draw thermal energy out of the substrate and away from the second semiconductor package, wherein the temperature adjusting component is offset from the first semiconductor package in the first direction, wherein the temperature adjusting component has a length, in the first direction, that is at least as long as a length of the second semiconductor package, and wherein the temperature adjusting component extends in the first direction from at least a first vertical edge of the second semiconductor package to at least a second vertical edge of the second semiconductor package.