Semiconductor structure, chip package structure, and computing device

A chip package structure, comprising:

• a first semiconductor structure, comprising:
• a first wafer layer including a first logic die and a second logic die arranged along a first direction;
• a second wafer layer including a third logic die, the third logic die stacked on a first side of the first wafer layer;
• a first inter-die interface between the first logic die and the third logic die, the first inter-die interface configured to enable data communication between the first logic die and the second logic die through the first inter-die interface;
• and
• a second inter-die interface between the second logic die and the third logic die, the second inter-die interface configured to enable data communication between the second logic die and the third logic die through the second inter-die interface, wherein the first inter-die interface and the second inter-die interface are coupled to one another through an intra-die wiring of the third logic die;
• and
• a package substrate, disposed on a second side of the first wafer layer.

A semiconductor device, comprising:

• a body;
• a first die and a second die on the body;
• a third die on the first die and the second die;
• a first interface element electrically coupled between the first die and the third die;
• and
• a second interface element electrically coupled between the second die and the third die,
• wherein the first interface element and the second interface element are coupled to one another through a first wiring element within the third die.