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US 2026/0096487 A1Published application
Semiconductor die stacks using direct bonds
AssigneeMicron Technology, Inc.
InventorsYoungrae KIM, Sui Chi HUANG, Youngik KWON
Life of this patent
Estimating the term…
Abstract
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes: a substrate; a stack of one or more semiconductor dies, the one or more semiconductor dies including a first semiconductor die directly bonded to a second semiconductor die; and one or more conductive pillars that electrically couple respective semiconductor dies of the one or more semiconductor dies with the substrate.
Claims23
An integrated assembly, comprising:
- a substrate;
- a stack of one or more semiconductor dies, the one or more semiconductor dies comprising a first semiconductor die directly bonded to a second semiconductor die;
- and
- one or more conductive pillars that electrically couple respective semiconductor dies of the one or more semiconductor dies with the substrate.
1 more element
An integrated assembly, comprising:
- a substrate;
- a shingled stack of one or more memory devices, the one or more memory devices having slanted sidewalls;
- and
- one or more conductive pillars that electrically couple respective memory devices of the one or more memory devices with the substrate.
1 more element
A method, comprising:
- forming a staggered stack of one or more semiconductor dies, the one or more semiconductor dies having slanted sidewalls;
- forming a layer of first conductive material over the staggered stack of the one or more semiconductor dies, the layer of the first conductive material in contact with the slanted sidewalls of the one or more semiconductor dies;
- forming one or more pillars of a second conductive material, the one or more pillars electrically coupled with respective semiconductor dies of the one or more semiconductor dies;
- and
- forming a redistribution layer comprising one or more contacts electrically coupled to respective pillars of the one or more pillars.
2 more elements
Dependencies are inferred from the claim text.