Semiconductor package

A semiconductor package comprising:

• a substrate;
• a logic die on the substrate;
• a base insulating layer on side surfaces and an upper surface of the logic die;
• an insulating layer through via extending through the base insulating layer at a side of the logic die;
• a high bandwidth memory on an upper surface of the base insulating layer;
• an optical structure on an upper surface of the base insulating layer;
• and
• an optical connector comprising an optical fiber configured to transmit an optical signal between the optical structure and an external device,
• wherein the high bandwidth memory comprises a plurality of memory dies stacked in a first direction that is perpendicular to the upper surface of the base insulating layer,
• wherein, in plan view, the optical structure overlaps at least a portion of the logic die, and
• wherein the optical structure is connected to the logic die in the first direction.

A semiconductor package comprising:

• a substrate;
• and
• a plurality of chiplets on the substrate,
• wherein each of the plurality of chiplets comprises:
• a logic die on the substrate;
• a base insulating layer on side surfaces and an upper surface of the logic die;
• an insulating layer through via extending through the base insulating layer at a side of the logic die;
• a high bandwidth memory on an upper surface of the base insulating layer;
• an optical structure on the upper surface of the base insulating layer;
• and
• an optical connector comprising an optical fiber configured to transmit an optical signal between the optical structure and an external device,
• wherein the high bandwidth memory comprises a plurality of memory dies stacked in a first direction that is perpendicular to the upper surface of the base insulating layer, and
• wherein the optical structure is connected to the logic die in the first direction.