Semiconductor package structure, fabrication method and memory system

A method of fabricating a semiconductor package structure, comprising:

• forming a first connection structure extending through a first die, and forming a first bonding sub-layer having a first bonding sub-contact at a first end of the first connection structure along a first direction, wherein the first end of the first connection structure is coupled with the first bonding sub-contact;
• forming a second connection structure extending through a second die, and forming a second bonding sub-layer having a second bonding sub-contact at a first end of the second connection structure along the first direction, wherein the first end of the second connection structure is coupled with the second bonding sub-contact;
• bonding the first bonding sub-layer and the second bonding sub-layer to form a first semiconductor chip, wherein the first bonding sub-layer and the second bonding sub-layer are bonded to form a first bonding layer, and the first bonding sub-contact and the second bonding sub-contact are bonded to form a first bonding contact;
• and
• stacking a second semiconductor chip on the first semiconductor chip, wherein the second semiconductor chip is coupled with the first semiconductor chip.

A memory system, comprising:

• a semiconductor package structure, comprising:
• a first semiconductor chip and a second semiconductor chip stacked along a first direction and coupled with each other, wherein the first semiconductor chip comprises a first die and a second die that are bonded along the first direction, and the first die is coupled with the second die through a first bonding contact;
• a first connection structure extending through the first die along the first direction;
• and
• a second connection structure extending through the second die along the first direction, wherein the first bonding contact is located between the first connection structure and the second connection structure in the first direction, and the first connection structure is coupled with the second connection structure through the first bonding contact.