Electronic package and manufacturing method thereof

Abstract

An electronic package and a manufacturing method thereof are provided, in which a bridge chip is disposed on one side of a wiring structure, and an electronic component and an optical engine are disposed on the other side of the wiring structure. The bridge chip, the electronic component and the optical engine are electrically connected to the wiring structure, so that the electronic component and the optical engine can be electrically connected to each other via the bridge chip, such that the path of electrical transmission is shortened and the loss and power consumption of data transmission are reduced.

Dependencies are inferred from the claim text.