Electronic device including stacked semiconductor chips and method of manufacturing the same

A method of preparing an electronic device, comprising:

• forming a first assembly comprising a first semiconductor chip, a second semiconductor chip and a plurality of electrical connectors, wherein the second semiconductor chip is stacked on the first semiconductor chip, and wherein the electrical connectors are connected to the first semiconductor chip;
• forming a second assembly comprising a third semiconductor chip, a fourth semiconductor chip and a plurality of bumps, wherein the fourth semiconductor chip is stacked on the third semiconductor chip, and wherein the bumps are connected to the third semiconductor chip;
• forming a third assembly comprising a fifth semiconductor chip and a plurality of external connectors, wherein the third assembly comprises a fifth lower structure and a fifth upper structure, and wherein the external connectors are connected to the fifth lower structure;
• forming a carrier structure comprising a carrier substrate, a plurality of through semiconductor vias penetrating the carrier substrate, a plurality of conductive plates on the carrier substrate and the through semiconductor vias, and a bonding layer on the carrier substrate and covering the conductive plates;
• electrically connecting the second assembly to the first assembly through the plurality of bumps;
• electrically connecting the first assembly to the third assembly through the plurality of electrical connectors;
• encapsulating the first assembly, the second assembly and the third assembly with a periphery encapsulant around the first assembly and the second assembly, and on the third assembly;
• and
• performing a hybrid bonding to electrically connect the carrier structure to the second assembly and the periphery encapsulant.