Method of manufacturing an electronic device

A method of manufacturing an electronic device, comprising the following steps:

• a) providing an assembly of die-to-wafer type comprising a wafer substrate having a first die formed therein and having conductive areas and connection pads positioned on a top surface thereof, a second die being mounted on the wafer substrate, a first surface of the second die being arranged facing the first die and connected to the first die, the second die comprising through silicon vias electrically coupled to the connection pads of the first die and emerging onto a second surface of the second die;
• b) forming conductive pillars on the connection areas of the first die, said conductive pillars extending through openings in a resin layer, an upper surface of the conductive pillars being flush with the second surface of the second die;
• c) removing the resin layer;
• d) forming a passivation layer on the substrate and on the second die, wherein openings formed in the passivation layer are located opposite the through silicon vias of the second die and opposite the upper surface of the conductive pillars formed during step b);
• and
• e) forming conductive elements in the openings in the passivation layer, said conductive elements located on the conductive pillars and on the through silicon vias, wherein a periphery of the conductive elements is covering the passivation layer.