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US 2026/0096461 A1Published application
Electronic chip, having a locally patterned peripheral area, intended to be glued to substrate
AssigneeSTMicroelectronics International N.V.
InventorsLou ROULON, Boris BOUILLARD
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Abstract
An electronic chip includes a first main surface, intended to be glued to a substrate, a second main surface, and lateral surfaces. The second main surface includes a central area and a locally patterned peripheral area. The locally patterned peripheral area successively forms, from the central area, a first portion having a first thickness and a second portion having a second thickness. The first thickness is smaller than the thickness of the central area. The second thickness is greater than the first thickness and smaller than the thickness of the central area.
Claims15
An electronic chip, comprising:
- a first main surface configured to be glued to a substrate;
- a second main surface;
- lateral surfaces;
- wherein the second main surface comprises a central area and a peripheral area;
- wherein the peripheral area has a local pattern at a first edge which successively forms, from the central area:
- a first portion of the peripheral area having a first thickness;
- a second portion of the peripheral area having a second thickness;
- and
- a third portion of the peripheral area having a third thickness;
- wherein the second portion is positioned between the first and third portions;
- wherein the first thickness is less than a thickness of the central area;
- wherein the second thickness is greater than the first thickness and less than the thickness of the central area;
- and
- wherein the third thickness is less than the second thickness.
11 more elements
Dependencies are inferred from the claim text.