Electronic device

An electronic device comprising:

• a first electronic component;
• a second electronic component;
• a sealing resin covering the first electronic component and the second electronic component;
• a first lead including a first inner portion covered by the sealing resin and a first outer portion exposed from the sealing resin, the first lead being electrically connected to the first electronic component;
• a second lead including a second inner portion covered by the sealing resin and a second outer portion exposed from the sealing resin, the second lead being electrically connected to the first electronic component;
• a third lead including a third inner portion covered by the sealing resin and a third outer portion exposed from the sealing resin, the third lead being electrically connected to the first electronic component;
• a fourth lead including a fourth inner portion covered by the sealing resin and a fourth outer portion exposed from the sealing resin, the fourth lead being electrically connected to the second electronic component;
• a first die pad supporting the first electronic component;
• and
• a second die pad supporting the second electronic component,
• wherein the sealing resin includes a plurality of resin side surfaces facing respective orthogonal directions each perpendicular to a thickness direction of the sealing resin,
• the first outer portion, the second outer portion, and the third outer portion are each exposed from a resin side surface that is different from a resin side surface from which the fourth outer portion is exposed.