Package grooves to inhibit delamination

A semiconductor package, comprising:

• a semiconductor die;
• a die pad having a first surface coupled to the semiconductor die and a second surface opposite the first surface, the die pad including an extension that comprises a first groove in the second surface, wherein an edge of the extension at the second surface is curved to have a rounded shape;
• a first conductive terminal having first and second ends and a third surface facing a same direction as the second surface, the third surface comprising a second groove, wherein an edge of the first conductive terminal at the third surface is curved to have the rounded shape;
• a second conductive terminal having third and fourth ends and a fourth surface facing the same direction as the second surface, the fourth surface comprising a third groove, the extension in between the second and fourth ends, wherein an edge of the second conductive terminal at the fourth surface is curved to have the rounded shape;
• and
• a mold compound covering the semiconductor die, the die pad, and the first and second conductive terminals, the mold compound filling the first, second, and third grooves, and the first and third ends extending to an exterior of the mold compound.

A semiconductor package, comprising:

• a semiconductor die;
• a die pad having a first surface coupled to the semiconductor die and a second surface opposite the first surface, the die pad including an extension that comprises a first V-shaped groove in the second surface;
• a first conductive terminal having first and second ends and a third surface facing a same direction as the second surface, the third surface comprising a second V-shaped groove;
• a second conductive terminal having third and fourth ends and a fourth surface facing the same direction as the second surface, the fourth surface comprising a third V-shaped groove, the extension in between the second and fourth ends;
• and
• a mold compound covering the semiconductor die, the die pad, and the first and second conductive terminals, the mold compound filling the first, second, and third V-shaped grooves, and the first and third ends extending to an exterior of the mold compound.

A method for manufacturing a semiconductor package, comprising:

• coupling a semiconductor die to a die pad, the die pad including an extension;
• wire bonding the semiconductor die to first and second conductive terminals, the extension extending between the first and second conductive terminals, a first groove in the extension extending across an entire width of the extension, a second groove extending across a portion of the first conductive terminal, and a third groove extending across a portion of the second conductive terminal, the first, second, and third grooves aligned such that a line extends through the first, second, and third grooves;
• and
• covering the semiconductor die, the die pad, and the first and second conductive terminals with a mold compound and filling the first, second, and third grooves with the mold compound.