Package structure

A package structure, comprising:

• a leadframe comprising a first lead;
• an encapsulant encapsulating the first lead and defining a first opening and a second opening partially exposing the first lead;
• a first reflowable material disposed in the first opening and comprising a portion protruding out of the first opening by a protruding distance;
• and
• a second reflowable material disposed in the second opening, wherein a difference between a height of the first reflowable material and a height of the second reflowable material is less than the protruding distance.

A package structure, comprising:

• a leadframe having a first surface and a second surface opposite to the first surface;
• an electronic component disposed over and electrically connected to the first surface of the leadframe;
• an encapsulant encapsulating the leadframe;
• a first solder ball disposed over the second surface of the leadframe;
• and
• an insulating element configured to cover a portion of the second surface of the leadframe exposed by the encapsulant, wherein a material of the insulating element is different from a material of the encapsulant.