Semiconductor device

A semiconductor device comprising:

• a first die pad including a first mounting surface and a first reverse surface facing away from each other in a first direction;
• a first semiconductor element mounted on the first mounting surface;
• a first lead spaced apart from the first die pad;
• a first conductive member conductively bonded to the first semiconductor element and the first lead;
• and
• a sealing resin covering the first die pad, the first semiconductor element, and the first conductive member, wherein
• the first semiconductor element includes a first element surface facing the same side as the first mounting surface in the first direction,
• the sealing resin includes a top surface facing the same side as the first mounting surface in the first direction, a bottom surface facing away from the top surface in the first direction, and a first side surface facing one side in a second direction orthogonal to the first direction,
• the first lead protrudes from the first side surface,
• when D1 is a first distance in the first direction between the first mounting surface and the top surface, D2 is a second distance in the first direction between the first reverse surface and the bottom surface, and D3 is a third distance in the first direction between the first element surface and the top surface, a relationship D1>D2≥D3 is satisfied, and
• the first conductive member is located between the first mounting surface and the top surface in the first direction.