Capacitor having electrodes formed within a substrate

An apparatus, comprising:

• a substrate having a first surface and a second surface that is on an opposite side of the substrate with respect to the first surface;
• and
• a decoupling capacitor, comprising:
• a first plurality of via stacks, arranged in a first grid arrangement, that each extend from the first surface to a first inner layer of the substrate between the first surface and the second surface;
• a second plurality of via stacks, arranged in a second grid arrangement, that each extend from the second surface to a second inner layer of the substrate between the first surface and the second surface;
• and
• dielectric material separating every via stack included in the first plurality of via stacks from every via stack included in the second plurality of via stacks,
• wherein electrodes of the decoupling capacitor are entirely within a region between the first surface and the second surface.

A substrate, comprising:

• a first surface on a first side of the substrate;
• a second surface on a second side of the substrate that is opposite the first side;
• a first plurality of via pillars configured as first electrodes of a decoupling capacitor and positioned between the first surface and the second surface;
• a second plurality of via pillars configured as second electrodes of the decoupling capacitor and positioned between the first surface and the second surface,
• wherein the first electrodes and the second electrodes are entirely within a region between the first surface and the second surface;
• and
• at least one dielectric material arranged to:
• separate the first plurality of via pillars from one another,
• separate the second plurality of via pillars from one another, and
• separate the first plurality of via pillars from the second plurality of via pillars.