Multi-chip module with adjusted mutual inductance for lna input matching

A packaged module comprising:

• a packaging substrate;
• and
• a multi-chip module mounted on the packaging substrate, the multi-chip module including a plurality of layers including a first layer, a second layer and a third layer, said second layer positioned between the first layer and third layer;
• a low noise amplifier circuit distributed across the plurality of layers and including a first inductor in the first layer, a second inductor in the third layer, and a transistor;
• a common ground plane spanning over at least a portion of the second layer;
• and a dielectric opening through the common ground plane, said dielectric opening located between the first inductor and the second inductor.

A wireless device comprising:

• an antenna configured to receive a radio frequency signal;
• a front end module in communication with the antenna, the front end module including a multi-chip module including a plurality of layers including a first layer, a second layer and a third layer, said second layer positioned between the first layer and third layer;
• a low noise amplifier circuit distributed across the plurality of layers and including a first inductor in the first layer, a second inductor in the third layer, and a transistor;
• a common ground plane spanning over at least a portion of the second layer;
• and a dielectric opening through the common ground plane, said dielectric opening located between the first inductor and the second inductor;
• and
• a transceiver in communication with the front end module.