Power modules, methods for manufacturing same, and electrical systems

A method, comprising:

• forming one or more power module units, wherein forming each power module unit comprises:
• forming an intra-cooling device from an insulating material;
• forming a first metal layer and a second metal layer on a top surface and a bottom surface of the intra-cooling device, respectively;
• coupling a first chip and a second chip on the first metal layer and the second metal layer, respectively;
• coupling a first conductive clip on the first chip and the first metal layer;
• and
• coupling a second conductive clip on the second chip and the second metal layer.

A system, comprising:

• a lead frame supporting a plurality of power module units in an array, each power module unit comprising:
• an insulating intra-cooling device;
• a first metal layer on a top surface of the intra-cooling device;
• a first chip coupled to the first metal layer;
• a second metal layer on a bottom surface of the intra-cooling device;
• and
• a second chip coupled to the second metal layer;
• a molded compound encapsulates the plurality of power module units;
• and
• at least one of a plurality of direct current (DC) terminals;
• and
• at least one of a plurality of alternating current (AC) terminals, wherein the plurality of DC terminals and the plurality of AC terminals are arranged in a symmetrical orientation.