Cooling fluid flow paths using Knife Edge Seals

An electronic assembly comprising:

• a circuit substrate comprising an integrated circuit, the circuit substrate having a first surface;
• and
• a heat removal substrate comprising a fluid path arranged for circulating a flow of cooling fluid between a fluid path input and a fluid path output, the heat removal substrate having a second surface attached to the first surface, wherein
• the fluid path includes a first cavity having cavity walls, wherein a first portion of the cavity walls comprises a first portion of the first surface and a second portion of the cavity walls comprises a first portion of the second surface;
• and wherein
• the second surface is attached to the first surface by at least a first cold weld compression seal that sealingly attaches the first portion of the first surface to the first portion of the second surface along a first closed boundary;
• said compression seal along that first closed boundary forming a third portion of the cavity walls.