Integrated circuit interposer including heat exchange fluid chamber and related methods

An interposer for an integrated circuit (IC) device, the interposer comprising:

• an interposer bottom and an interposer top coupled thereto and defining a heat exchange fluid chamber therebetween;
• a thermally conductive layer lining the heat exchange fluid chamber;
• a plurality of interposer dielectric pillars extending within the heat exchange fluid chamber between the interposer bottom and the interposer top;
• a heat exchange fluid within the heat exchange fluid chamber;
• a wick structure within the heat exchange fluid chamber for moving the heat exchange fluid in a liquid phase into the heat exchange fluid chamber;
• a plurality of electrically conductive through-vias extending within respective ones of the plurality of interposer dielectric pillars and being exposed on outer surfaces of the interposer bottom and the interposer top;
• and
• a plurality of blind thermally conductive vias extending into at least one of the interposer bottom and interposer top.

A method of making an interposer comprising:

• coupling an interposer bottom to an interposer top to define a heat exchange fluid chamber therebetween;
• forming a plurality of interposer dielectric pillars extending within the heat exchange fluid chamber between the interposer bottom and the interposer top;
• forming a heat exchange fluid within the heat exchange fluid chamber;
• forming a wick structure within the heat exchange fluid chamber for moving the heat exchange fluid in a liquid phase into the heat exchange fluid chamber;
• and
• forming a plurality of electrically conductive through-vias extending within respective ones of the plurality of interposer dielectric pillars and being exposed on outer surfaces of the interposer bottom and the interposer top.