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US 2026/0096431 A1Published application
Stacked Chip with Liquid Cooling Plate
AssigneeMetaone Corporation
InventorsKuo-Ching Chiang, Yueh-Feng Chiang
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Abstract
The present invention comprises a chip, a cooling substrate is formed over the first surface of the cooling substrate, a cooling channel is formed on the cooling substrate to dissipate the heat generated by the chip, wherein the cooling channel includes a cooling liquid or gas; a power substrate is provided and the power substrate includes a power grid to provide power to the chip from the second surface of the chip. The chip, the cooling substrate, and the power substrate are stacked together.
Claims20
A stacking chip comprising:
- a chip having a first surface and a second surface;
- and
- a cooling substrate formed over said first surface of said chip, wherein said cooling substrate has a cooling channel to transfer heat generated by said chip, said cooling channel including a cooling liquid or gas, wherein said chip, said cooling substrate are stacked together.
A stacking chip comprising:
- a chip having a first surface;
- a cooling substrate formed over said first surface of said chip, wherein said cooling substrate has a cooling channel to transfer heat generated by said chip, said cooling channel including a cooling liquid or gas;
- a power substrate is formed under said chip, wherein said power substrate includes a power grid to provide power to said chip from a second surface of said chip, wherein said chip, said cooling substrate and said power substrate are stacked together.
Dependencies are inferred from the claim text.