Power supply module for immersion cooling, signal connection substrate, and an assembly and manufacturing method

A signal connection substrate, comprising an upper surface and a lower surface opposite to each other, and a first side surface and a second side surface opposite to each other, wherein the signal connection substrate is a multi-layer circuit plate, and at least three metal layers are provided on the upper surface and the lower surface of the signal connection substrate respectively;

• the pin positions of the metal layer of the upper surface and the pin positions of the metal layer of the lower surface are arranged in a staggered manner;
• the signal connection substrate further comprises a shielding layer arranged on the first side surface of the signal connection substrate and/or on the second side surface of the signal connection substrate and/or in the signal connection substrate;
• an insulating layer is provided between the metal layer and the first side surface;
• the signal connection substrate is used for a stacked power supply module.

A assembly, wherein the assembly is used for a stacked power supply module, comprising an upper surface and a lower surface opposite to each other, a signal connection substrate and a passive element;

• the signal connection substrate comprises an upper surface and a lower surface opposite to each other, and a first side surface and a second side surface opposite to each other;
• the passive element comprises an upper surface and a lower surface opposite to each other;
• the second side surface of the signal connection substrate is arranged adjacent to one side surface of the passive element;
• the upper surface and the lower surface of the signal connection substrate are respectively provided with a metal layer, and the metal layer on the upper surface of the signal connection substrate is electrically connected to the corresponding metal layer of the lower surface;
• an insulating layer is disposed between the metal layer and the first side surface of the signal connection substrate;
• the upper surface and the lower surface of the passive element are respectively provided with a metal layer, and the upper surface and the lower surface of the passive element each comprises at least one metal layer for transmitting power;
• the metal layer of the upper surface of the signal connection substrate is coplanar with the metal layer of the upper surface of the passive element, and the metal layer of the lower surface of the signal connection substrate is coplanar with the metal layer of the lower surface of the passive element;
• a shortest distance between the first side surface and an edge of an adjacent metal layer is greater than zero.