Non-isolated direct cooled sic module

A semiconductor assembly, the assembly comprising:

• a semiconductor module having a first side and a second side, the semiconductor module including,
• a first side heatsink and a second side heatsink,
• a first side power device mounted to an upper surface of the first side heatsink and in electrical contact to the first side heatsink,
• a second side power device mounted to an upper surface of the second side heatsink and in electrical contact to the second side heatsink, and
• at least one cooling structure extending from a lower surface of at least one of the first side heatsink and the second side heatsink, the lower surface opposite the upper surface, the cooling structure configured to provide cooling of the semiconductor module;
• and
• a unified bus communicatively connected to a capacitor assembly, the first side power device, and the second side power device, the unified bus being sintered to the first side power device and the second side power device.