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US 2026/0096427 A1Published application
Cryogenic chip-on-chip assemblies with through substrate vias and methods of forming thereof
AssigneePsiquantum, Corp.
InventorsAlexey VERT, Vimal KAMINENI
Life of this patent
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Abstract
A device includes a photonic cryo die containing photonic components, and an electronic die bonded to the photonic die, the electronic die containing electrically conductive through substrate vias. The electrically conductive through silicon vias can electrically connect a backside redistribution layer to control circuitry for operation in a cryogenic environment in a compact package that exhibits low resistance and low parasitic capacitance.
Claims29
A device, comprising:
- a photonic cryo die comprising photonic components;
- and
- an electronic die bonded to the photonic die, the electronic die containing electrically conductive through substrate vias.
A method, comprising:
- forming openings through a substrate;
- filling the openings with electrically conductive through substrate vias;
- forming an electronic control circuit over a front side of the substrate in electrical contact with the through substrate vias;
- and
- bonding a photonic cryo die comprising photonic components to the electronic control circuit.
2 more elements
A cryo electronic die, comprising:
- a substrate;
- a plurality of through substrate vias that extend through the substrate of the cryo electronic die;
- a redistribution layer on a backside of the substrate, the redistribution layer being electrically conductive, the redistribution layer being electrically connected to the through substrate vias;
- and
- a control circuit on a front side of the substrate, the control circuit being electrically connected to the through substrate vias, the through substrate vias electrically connecting the redistribution layer to the control circuit.
2 more elements
Dependencies are inferred from the claim text.