Semiconductor structure with via extending across adjacent conductive lines

A semiconductor structure, comprising:

• a first tier conductive layer comprising a first conductive line;
• a second tier conductive layer over the first tier conductive layer, wherein the second tier conductive layer comprises a second conductive line, a third conductive line, and a conductive junction part laterally between the second conductive line and the third conductive line, and the second conductive line and the third conductive line extend along a widthwise direction of the first conductive line;
• a first conductive via electrically connected to the first conductive line and the second conductive line;
• and
• a second conductive via electrically connected to the first conductive line and the third conductive line, wherein the conductive junction part offsets from the first conductive via and the second conductive via in a lengthwise direction of the first conductive line.

A semiconductor structure having a conductive structure, comprising:

• a first conductive line;
• second conductive lines laterally extending across the first conductive line along a widthwise direction of the first conductive line, wherein the second conductive lines extend over the first conductive layer;
• a conductive junction part laterally connecting between the second conductive lines, wherein the conductive junction part overlaps with the first conductive line;
• and
• conductive vias disposed between and electrically connected to the first conductive line and the second conductive lines, wherein a lateral dimension of the conductive vias in a lengthwise direction of the first conductive line is less than a lateral dimension of the first conductive line in the lengthwise direction, and a lateral dimension of the conductive vias in the widthwise direction is greater than the lateral dimension of the first conductive line in the widthwise direction.