Method of manufacturing an interconnection for an electronic device

A method of manufacturing interconnects for an electronic device, comprising the following steps:

• a) providing an assembly comprising a substrate having a first die formed therein, wherein conductive areas are positioned on the substrate and connected to the first die, wherein a first surface of a second die is assembled to the first die by hybrid bonding, and wherein the second die comprises through silicon vias emerging onto a second surface of the second die;
• b) forming conductive wires on the conductive areas;
• c) encapsulating the conductive wires in a layer of insulating material deposited on the first surface of the substrate and on the second die;
• d) thinning the layer of insulating material to make the conductive wires accessible from an upper surface of the layer of insulating material;
• and
• e) forming conductive elements on the layer of insulating material opposite the conductive areas and opposite the through silicon vias, the conductive elements being coupled either to the conductive areas or to the through silicon vias, whereby interconnects for the first die and interconnects for the second die are obtained.