Step ramp grading yield enhancement for hybrid bonding

A method comprising:

• determining a first recess depth of a plurality of first contacts of a first substrate;
• determining a second recess depth of a plurality of second contacts of a second substrate;
• bonding the first substrate to the second substrate to form a bonded structure;
• and
• annealing the bonded structure to electrically couple the plurality of first contacts to the plurality of second contacts, wherein an annealing time is based on the first recess depth and the second recess depth.

A method comprising:

• determining a first recess depth of a plurality of first contacts of a first substrate;
• determining a second recess depth of a plurality of second contacts of a second substrate;
• determining, a variation between the first recess depths;
• ingesting, by a machine learning model trained to corelate a first plurality of dwell times with yield data for bonded structures, data comprising the first recess depth, the second recess depth, and the variation;
• determining, by the machine learning model based on the ingested data, an annealing time comprising a second plurality of dwell times;
• and
• annealing the first substrate and the second substrate according to the annealing time to electrically couple the plurality of first contacts to the plurality of second contacts.