Display panel and method of manufacturing display panel

A method of manufacturing a display panel, comprising:

• providing a silicon-based driver substrate;
• wherein the silicon-based driver substrate comprises a plurality of first bonding electrodes;
• providing a glass substrate;
• wherein the glass substrate comprises a first surface and a second surface opposite to the first surface;
• the glass substrate has a plurality of conductive through holes extending from the first surface to the second surface;
• the plurality of conductive through holes comprises a plurality of first conductive through holes;
• the first surface of the glass substrate has a plurality of receiving grooves;
• each of the plurality of receiving grooves is communicated with an end of a respective one of the plurality of first conductive through holes near the first surface;
• bonding a side of the second surface of the glass substrate to the silicon-based driver substrate;
• and embedding each of the plurality of first bonding electrodes into a respective one of the plurality of first conductive through holes;
• filling a predetermined volume of a conductive material into each of the plurality of the first conductive through holes from the first surface to form a plurality of first bonding portions;
• wherein a surface of each of the plurality of first bonding portions away from the silicon-based driver substrate is lower than or flush with the first surface of the glass substrate;
• the predetermined volume is greater than or equal to a minimum volume required to fully fill each of the plurality of first conductive through holes and is less than or equal to a sum of a maximum volume required to fill a maximum volume required to fill each of the plurality of first conductive through hole and a volume of the respective receiving groove;
• sequentially depositing anode electrodes, organic light emitting layers and cathode electrodes on the first surface of the glass substrate to form a plurality of light emitting units;
• wherein the plurality of first bonding portions are electrically connected to the anode electrodes through the plurality of first conductive through holes correspondingly.