Display panel, manufacturing method of the same, and display device

A manufacturing method of a display panel, comprising:

• preparing a drive circuit backplate;
• wherein the drive circuit backplate comprises a drive circuit layer;
• preparing a light-emitting unit carrier plate, comprising:
• defining a plurality of vias on a first substrate;
• preparing a pixel definition layer on the first substrate;
• wherein the pixel definition layer forms a plurality of pixel regions that are spaced apart, and orthogonal projections of the plurality of pixel regions on the first substrate are overlapped with orthogonal projections of some of the plurality of vias on the first substrate;
• forming a plurality of organic light-emitting diode devices in the plurality of pixel regions;
• wherein each organic light-emitting diode device comprises an anode film layer, a light-emitting layer, and a cathode film layer that are arranged in sequence from a side close to the drive circuit backplate toward a side away from the drive circuit backplate;
• the anode film layer, the light-emitting layer, and the cathode film layer of each organic light-emitting diode device are disposed in a corresponding pixel region;
• on a side of the first substrate away from the drive circuit backplate, the cathode film layer extends outside the plurality of pixel regions and covers the pixel definition layer;
• and
• preparing a bonding portion in each via;
• where the bonding portion is electrically connected to the anode film layer and the cathode film layer of a corresponding organic light-emitting diode device;
• the bonding portion protrudes from the first substrate toward the drive circuit backplate;
• preparing a first encapsulation layer on the cathode film layer;
• wherein in a direction from the cathode film layer to the first substrate, the first encapsulation layer extends onto the first substrate to encapsulate the plurality of organic light-emitting diode devices on the first substrate;
• connecting the drive circuit backplate to the light-emitting unit carrier plate;
• wherein the bonding portion abuts against the drive circuit layer, and a gap exists between the drive circuit backplate and the light-emitting unit carrier plate;
• and
• preparing a second encapsulation layer on the first encapsulation layer;
• wherein in a direction from the cathode film layer to the drive circuit backplate, the second encapsulation layer extends onto the drive circuit backplate to encapsulate the light-emitting unit carrier plate on the drive circuit backplate and encapsulate the gap between the drive circuit backplate and the light-emitting unit carrier plate.

A display device, comprising a display panel;

• wherein the display panel comprises:
• a drive circuit backplate, comprising a drive circuit layer;
• a light-emitting unit carrier plate, comprising:
• a first substrate, defining a plurality of vias;
• a pixel definition layer, disposed on the first substrate;
• wherein the pixel definition layer forms a plurality of pixel regions that are spaced apart, and orthogonal projections of the plurality of pixel regions on the first substrate are overlapped with orthogonal projections of some of the plurality of vias on the first substrate;
• a plurality of organic light-emitting diode devices;
• wherein each organic light-emitting diode device comprises an anode film layer, a light-emitting layer, and a cathode film layer that are arranged in sequence from a side close to the drive circuit backplate toward a side away from the drive circuit backplate;
• the anode film layer, the light-emitting layer, and the cathode film layer of each organic light-emitting diode device are disposed in a corresponding pixel region;
• on a side of the first substrate away from the drive circuit backplate, the cathode film layer extends outside the plurality of pixel regions and covers the pixel definition layer;
• and
• a plurality of bonding portions;
• wherein each bonding portion is disposed in a corresponding via, and the bonding portion is electrically connected to the anode film layer and the cathode film layer of a corresponding organic light-emitting diode device;
• the bonding portion protrudes from the first substrate toward the drive circuit backplate;
• in a case where the drive circuit backplate is connected to the light-emitting unit carrier plate, the bonding portion abuts against the drive circuit layer, and a gap exists between the drive circuit backplate and the light-emitting unit carrier plate;
• and
• an encapsulation layer, comprising:
• a first encapsulation layer and a second encapsulation layer;
• wherein the first encapsulation layer is disposed on the cathode film layer, and in a direction from the cathode film layer to the first substrate, the first encapsulation layer extends onto the first substrate to encapsulate the plurality of organic light-emitting diode devices on the first substrate;
• the second encapsulation layer is disposed on the first encapsulation layer, and in a direction from the cathode film layer to the drive circuit backplate, the second encapsulation layer extends onto the drive circuit backplate to encapsulate the light-emitting unit carrier plate on the drive circuit backplate and encapsulate the gap between the drive circuit backplate and the light-emitting unit carrier plate.