US 2026/0096256 A1 · LENS STRUCTURES IN MULTIPLE-CHIP LIGHT-EMITTING DIODE (LED) PACKAGES

Abstract

Light-emitting diode (LED) devices and more particularly lens structures in multiple-chip LED packages are disclosed. Lens structures include separate lenses positioned to reduce optical decoupling from corresponding LED chips. Individual lenses for each individual LED chip provide flexibility in tailoring each lens to provide a portion of aggregate emissions with a targeted profile. Multiple lenses may be integrally formed from a common encapsulant material. Other lens structures include separate lenses provided on or through encapsulant materials. Combinations of different LED chip structures and different lens structures within a common LED package are disclosed.

Claims26

Dependent claims

A light-emitting diode (LED) package comprising:

a submount;
a plurality of LED chips on the submount;
and
an encapsulant on the plurality of LED chips and the submount, the encapsulant forming a plurality of lenses on the plurality of LED chips and a lateral extension integrally connecting each lens of the plurality of lenses, the lateral extension further extending to a perimeter edge of the submount.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

18/901,734Filed 30 Sep 2024

Published

2 Apr 2026

Term ends

Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10H 20/855
Packages: optical field-shaping means, e.g. lenses
H10H 20/8515
Wavelength conversion means: not being in contact with the bodies
H10H 20/853
Encapsulations: characterised by their shape
H10H 29/24
Assemblies of multiple devices comprising at least one light-emitting semiconductor device covered by group H10H20/00: comprising multiple…

Lens structures in multiple-chip light-emitting diode (led) packages

Life of this patent

Lens structures in multiple-chip light-emitting diode (led) packages

Life of this patent

Abstract

Claims26