Semiconductor device as well as a method of manufacturing such semiconductor device

A semiconductor device comprising:

• a first lead frame with a first surface and a second surface, wherein the first surface of the first lead frame is directly opposite to the second surface of the first lead frame, comprising at least one external first lead frame terminal and a first die paddle,
• a second lead frame with a first surface and a second surface, wherein the first surface of the second lead frame is directly opposite to the second surface of the second lead frame, the second lead frame comprising at least one external second lead frame terminal and a second die paddle,
• a common clip with a first surface and a second surface, wherein the first surface is directly opposite to the second surface, the common clip comprising at least one external source clip terminal, a first source contact and a second source contact,
• a common gate clip with a first surface and a second surface, wherein the first surface is directly opposite to the second surface, the common gate clip comprising an external common clip gate terminal, a clip contact and a gate clip contact,
• a first semiconductor die with a first surface and a second surface, wherein the first surface of the first semiconductor die is directly opposite to the second surface of the first semiconductor die, the first semiconductor die comprising a first die gate terminal, a first die source terminal, and a first die drain terminal, wherein the first die gate terminal and the first die source terminal are located on the second surface of the first semiconductor die, and the first die drain terminal is located on the first surface of the first semiconductor die,
• a second semiconductor die with a first surface die and a second surface, wherein the first surface of the second semiconductor die is directly opposite to the second surface of the second semiconductor die, the second semiconductor die comprising a second die gate terminal, a second die source terminal, and a second die drain terminal, wherein the second die gate terminal and the second die source terminal are located on the second surface of the second semiconductor die, and the second die drain terminal is located on the first surface of the second semiconductor die,
• wherein the first die gate terminal is connected by connecting means with the first surface of the clip contact, and the second die gate terminal is connected by connecting means with the first surface of the gate clip contact,
• wherein the first die source terminal is connected by connecting means with the first surface of the first source contact, and the second die source terminal is connected by connecting means with the first surface of the second source contact,
• wherein the first drain terminal is connected by connecting means with the second surface of the first die paddle contact area, and the second drain terminal is connected by connecting means with the second surface of the second die paddle contact area, and
• an encapsulation which encapsulates the first die, the second die, the first lead frame, the second lead frame, the common clip and the common gate clip, so that the at least one external first lead frame terminal, the at least one external second lead frame terminal, the first surface of the first die paddle contact area and the first surface of the second die paddle contact area, the external common clip gate terminal, the at least one external source clip terminal, and an external source clip flat terminal of the common clip, are exposed.