Semiconductor device and method for manufacturing same
AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYasuhiro ISOBE, Yasunobu SAITO, Akira YOSHIOKA
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AssigneesKabushiki Kaisha Toshiba, Toshiba Electronic Devices & Storage Corporation
InventorsYasuhiro ISOBE, Yasunobu SAITO, Akira YOSHIOKA
Estimating the term…
A semiconductor device includes a substrate; a gallium nitride layer located on a non-polar surface of the substrate, the gallium nitride layer including a plurality of fin parts separated from each other in a first direction parallel to a c-axis direction, the plurality of fin parts extending in a second direction; an electron supply layer located at a Ga-surface of at least one of the fin parts; a source finger part extending in the first direction and contacting the electron supply layer; a drain finger part extending in the first direction and contacting the electron supply layer, the drain finger part being separated from the source finger part in the second direction; and a gate electrode positioned between the source finger part and the drain finger part, the gate electrode facing the electron supply layer in the first direction.
A semiconductor device, comprising:
A method for manufacturing a semiconductor device, the method comprising:
Dependencies are inferred from the claim text.